Cross-section analysis for electronics is used to examine the internal microstructure of electronic components like printed circuit boards (PCBs), assemblies (PCBAs), and integrated circuits (ICs). These components are often made from opaque, non-transparent materials. For cross-section analysis, a cross section of the component is made and analyzed with optical and electron microscopy and spectroscopy to reveal the structure and composition of grains, phases, layers, interfaces, cracks, voids, defects, etc. Cross-section analysis is useful for quality control (QC), failure analysis (FA), and research and development (R&D) of PCBs, PCBAs, ICs, and other electronic components.
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What is a cross section in manufacturing?
For cross sectioning of materials like metal alloys, ceramics, printed circuit boards (PCBs) or assemblies (PCBAs), or integrated circuits (ICs), a slice is made across its volume in a specific orientation to expose the bulk. The internal microstructure can then be observed. For PCBs and ICs, cross sectioning is useful for quality control and failure analysis.
What is a cross section in manufacturing?
For cross sectioning of materials like metal alloys, ceramics, printed circuit boards (PCBs) or assemblies (PCBAs), or integrated circuits (ICs), a slice is made across its volume in a specific orientation to expose the bulk. The internal microstructure can then be observed. For PCBs and ICs, cross sectioning is useful for quality control and failure analysis.
What is a cross section in manufacturing?
For cross sectioning of materials like metal alloys, ceramics, printed circuit boards (PCBs) or assemblies (PCBAs), or integrated circuits (ICs), a slice is made across its volume in a specific orientation to expose the bulk. The internal microstructure can then be observed. For PCBs and ICs, cross sectioning is useful for quality control and failure analysis.